These can be classified in various ways, such as by time or cause. Several topologies fo r. Insulator damage by weakening of the insulator structures. The difference in thermal expansion of the fibers and the matrix weakens the bond when the board is soldered; the lead-free solders which require higher soldering temperatures increase the occurrence of CAFs. 1 The only common failure mode of an inductor is overheating, which can be from too much current (saturation) or too wide of a pulse width. Liquid crystal coatings can be used for localization of faults: cholesteric liquid crystals are thermochromic and are used for visualisation of locations of heat production on the chips, while nematic liquid crystals respond to voltage and are used for visualising current leaks through oxide defects and of charge states on the chip surface (particularly logical states). 5. current loads might have a decisive effect on the serv ice life and usability of chokes and inductors. 20). Other through hole devices are conformally coated or overmolded. Cables, in addition to the methods described above, may fail by fraying and fire damage. Polar covalent compounds can attract moisture like antistatic agents, forming a thin layer of conductive moisture between the traces; ionic compounds like chlorides tend to facilitate corrosion. There is an increasing use and reliance on electronics in daily life, from portable electronics to pacemakers, high reliability of these systems is expected and demanded. For solid state devices, connection between the counter electrode (polymer or MnO2) and the negative LF is made using conductive pastes and/or solders. The dielectric, amorphous Ta2O5, typically a few tens of nm thick, is electrochemically grown on all surfaces of the porous Ta anode [1]. 18), disconnection between either of the leads and the end termination will result in no capacitance (open failure mode).
